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Focussed ion beam based fabrication of micro-electro-mechanical resonators

Grogg, Daniel ; Badila-Ciressan, Nicoleta ; Ionescu, Adrian

In: Microsystem Technologies, 2008, vol. 14, no. 7, p. 1049-1053

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    Titre
    • Focussed ion beam based fabrication of micro-electro-mechanical resonators
    Auteur
    • Grogg, Daniel. Micro/Nano Electronics Laboratory, Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
    • Badila-Ciressan, Nicoleta. Micro/Nano Electronics Laboratory, Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
    • Ionescu, Adrian. Micro/Nano Electronics Laboratory, Ecole Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland
    Type de document
    • Postprint
    Langue
    • Inglese
    Publié dans
    • Microsystem Technologies, 2008, vol. 14, no. 7, p. 1049-1053. Springer-Verlag
    Autre version électronique
    Classification
    • Electricité
    Identifiant OAI-PMH
    • oai:doc.rero.ch:319888
    Summary
    A simple and fast process to fabricate micro-electro-mechanical (MEM) resonators with deep sub-micron transduction gaps in thin SOI is presented. The proposed process is realized on both 350nm and 1.5μm thin silicon-on-insulator (SOI) substrates, evaluating the possibilities for MEMS devices on thin SOI for future co-integration with CMOS circuitry on a single chip. Through the combination of conventional UV-lithography and focused ion beam (FIB) milling the process needs only two lithography steps, achieving ∼100nm gaps, thus ensuring an effective transduction. Different FIB parameters and etching parameters and their effect on the process are reported