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An experimental investigation of microresistor laser printing with gold nanoparticle-laden inks

Bieri, N.R. ; Chung, J. ; Poulikakos, D. ; Grigoropoulos, C.P.

In: Applied Physics A, 2005, vol. 80, no. 7, p. 1485-1495

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    Titre
    • An experimental investigation of microresistor laser printing with gold nanoparticle-laden inks
    Auteur
    • Bieri, N.R.. Laboratory of Thermodynamics in Emerging Technologies, Institute of Energy Technology, ETH Swiss Federal Institute of Technology, ETH Zentrum, 8092, Zurich, Switzerland
    • Chung, J.. Department of Mechanical Engineering, Korea University, Seoul, Korea
    • Poulikakos, D.. Laboratory of Thermodynamics in Emerging Technologies, Institute of Energy Technology, ETH Swiss Federal Institute of Technology, ETH Zentrum, 8092, Zurich, Switzerland
    • Grigoropoulos, C.P.. Department of Mechanical Engineering, University of California, 94720, Berkeley, CA, USA
    Type de document
    • Postprint
    Langue
    • Anglais
    Publié dans
    • Applied Physics A, 2005, vol. 80, no. 7, p. 1485-1495. Springer-Verlag; www.springer.de
    Autre version électronique
    Classification
    • Technologie, Sciences de l'ingénieur
    Identifiant OAI-PMH
    • oai:doc.rero.ch:315314
    Summary
    This paper presents an experimental investigation of the novel thermal manufacturing process of printing and laser curing of nanoparticle-laden inks that can produce functional microstructures such as electronic microresistors and interconnections for semiconductors and other devices. Of specific interest are the complex and interweaved transport phenomena involved, focusing on the absorption and diffusion processes of irradiated laser energy influencing solvent vaporization, the nanoparticle curing process, the substrate, and the final quality of the produced resistor. Parametric studies of the thermal process together with extensive microscopy analysis of the topography and resistivity measurements piece together a better understanding of the underlying physics and aid the development of the technology