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Low temperature TLP bonding of Al2O3-ceramics using eutectic Au-(Ge, Si) alloys

Weyrich, Nico ; Leinenbach, Christian

In: Journal of Materials Science, 2013, vol. 48, no. 20, p. 7115-7124

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    Titre
    • Low temperature TLP bonding of Al2O3-ceramics using eutectic Au-(Ge, Si) alloys
    Auteur
    • Weyrich, Nico. Laboratory for Joining Technologies and Corrosion, Empa—Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    • Leinenbach, Christian. Laboratory for Joining Technologies and Corrosion, Empa—Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    Type de document
    • Postprint
    Langue
    • Anglais
    Publié dans
    • Journal of Materials Science, 2013, vol. 48, no. 20, p. 7115-7124. Springer US; http://www.springer-ny.com
    Autre version électronique
    Classification
    • Technologie, Sciences de l'ingénieur
    Identifiant OAI-PMH
    • oai:doc.rero.ch:311410
    Summary
    In this study, Al2O3-ceramics were joined via TLP bonding using interlayers of eutectic Au-12Ge (wt%) and Au-3Si (wt%) solder alloys, respectively, with a melting temperature of 361 and 363°C and Ni wetting layers. The Ni layers were part of a metallic multilayer coating (Ti/W/Ni) applied on the ceramic surface to ensure wetting and adhesion during the joining process. For comparison, a soldering process was performed as well by changing the multilayer structure to Ti/W/Au. With respect to the different joining processes the influence of the variation in wetting layers on the interface reactions, mechanical properties and re-melting temperature was analyzed by scanning electron microscopy, shear testing, and differential scanning calorimetry. It is shown that sound joint can be produced at a joining temperature of 400°C, achieving reasonable shear strength and re-melting temperatures more than 550°C above the initial melting temperature of the filler metal