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Characterization of the isothermal solidification process in the Ni/Au-Ge layer system

Weyrich, Nico ; Leinenbach, Christian

In: Journal of Materials Science, 2015, vol. 50, no. 10, p. 3835-3844

Microstructure and Mechanical Performance of Cu-Sn-Ti-Based Active Braze Alloy Containing In Situ Formed Nano-Sized TiC Particles

Leinenbach, Christian ; Transchel, Robert ; Gorgievski, Klea ; Kuster, Friedrich ; Elsener, Hans ; Wegener, Konrad

In: Journal of Materials Engineering and Performance, 2015, vol. 24, no. 5, p. 2042-2050

Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni-)Sn Interlayer Combinations

Lis, Adrian ; Leinenbach, Christian

In: Journal of Electronic Materials, 2015, vol. 44, no. 11, p. 4576-4588

Long-ranged Cu-based order with $$d_{z^2}$$ orbital character at a YBa2Cu3O7/ manganite interface

Gaina, Roxana ; Nicholson, Christopher W. ; Rumo, Maxime ; Sarkar, Subhrangsu ; Khmaladze, Jarji ; Paris, Eugenio ; Tseng, Yi ; Zhang, Wenliang ; Asmara, Teguh C. ; McNally, Daniel ; Piamonteze, Cinthia ; Weschke, Eugen ; Schmitt, Thorsten ; Monney, Claude ; Bernhard, Christian

In: npj Quantum Materials, 2021, vol. 6, no. 1, p. 12

The interplay of nearly degenerate orders in quantum materials can lead to a myriad of emergent phases. A prominent case is that of the high-Tc cuprates for which the relationship between superconductivity and a short-ranged, incommensurate charge density wave in the CuO2 planes involving the dx2−y2 orbitals (Cu-CDW) is a subject of great current interest. Strong modifications of the...

Thermal energy transport across the interface between phase change material n-heneicosane in solid and liquid phases and few-layer graphene

Chilukoti, Hari Krishna ; Zhou, Tianhang ; Ardham, Vikram Reddy ; Böhm, Michael C. ; Müller-Plathe, Florian

In: The Journal of Physical Chemistry C, 2019, vol. 123, no. 48, p. 29192–29202

Molecular dynamics simulations have been performed to investigate the mechanism of thermal energy transport at the interface between n-heneicosane in solid and liquid phases and few-layer graphene at different temperatures under two heating modes (in the “heat-matrix” mode, heat is flowing from the heated heneicosane molecules to the cooled ones through the graphene layers and in the...

Interfacial Design for Joining Technologies: An Historical Perspective

Janczak-Rusch, J. ; Kaptay, G. ; Jeurgens, L.

In: Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1608-1613

Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys

Weyrich, Nico ; Jin, Shan ; Duarte, Liliana ; Leinenbach, Christian

In: Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1585-1592

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

Maleki, Milad ; Cugnoni, Joë ; Botsis, John

In: Journal of Electronic Materials, 2014, vol. 43, no. 4, p. 1026-1042

Guest Editorial

Janczak-Rusch, Jolanta ; Straumal, Boris ; Passerone, Alberto ; Jeurgens, Lars ; Kaptay, George ; Kaban, Ivan

In: Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1513-1514

Packmem: a versatile tool to compute and visualize interfacial packing defects in lipid bilayers

Gautier, Romain ; Bacle, Amélie ; Tiberti, Marion L. ; Fuchs, Patrick F. ; Vanni, Stefano ; Antonny, Bruno

In: Biophysical Journal, 2018, vol. 115, no. 3, p. 436–444

The analysis of the structural organization of lipid bilayers is generally performed across the direction normal to the bilayer/water interface, whereas the surface properties of the bilayer at the interface with water are often neglected. Here, we present PackMem, a bioinformatic tool that performs a topographic analysis of the bilayer surface from various molecular dynamics simulations....