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24 Ergebnisse 1 2 3
Postprint
Consortium of Swiss Academic Libraries

Characterization of the isothermal solidification process in the Ni/Au-Ge layer system

Weyrich, Nico ; Leinenbach, Christian

In: Journal of Materials Science, 2015, vol. 50, no. 10, p. 3835-3844

Postprint
Consortium of Swiss Academic Libraries

Microstructure and Mechanical Performance of Cu-Sn-Ti-Based Active Braze Alloy Containing In Situ Formed Nano-Sized TiC Particles

Leinenbach, Christian ; Transchel, Robert ; Gorgievski, Klea ; Kuster, Friedrich ; Elsener, Hans ; Wegener, Konrad

In: Journal of Materials Engineering and Performance, 2015, vol. 24, no. 5, p. 2042-2050

Postprint
Consortium of Swiss Academic Libraries

Interfacial Design for Joining Technologies: An Historical Perspective

Janczak-Rusch, J. ; Kaptay, G. ; Jeurgens, L.

In: Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1608-1613

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Consortium of Swiss Academic Libraries

Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys

Weyrich, Nico ; Jin, Shan ; Duarte, Liliana ; Leinenbach, Christian

In: Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1585-1592

Postprint
Consortium of Swiss Academic Libraries

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

Maleki, Milad ; Cugnoni, Joë ; Botsis, John

In: Journal of Electronic Materials, 2014, vol. 43, no. 4, p. 1026-1042

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Consortium of Swiss Academic Libraries

The implant material, Ti6Al7Nb: surface microstructure, composition and properties

Sittig, C. ; Ha¨hner, G. ; Marti, A. ; Textor, M. ; Spencer, N. ; Hauert, R.

In: Journal of Materials Science: Materials in Medicine, 1999, vol. 10, no. 4, p. 191-198

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Consortium of Swiss Academic Libraries

Assessment of the Atomic Mobilities in fcc Cu-Fe and Cu-Ti Alloys

Wang, J. ; Leinenbach, C. ; Liu, L. ; Liu, H. ; Jin, Z.

In: Journal of Phase Equilibria and Diffusion, 2011, vol. 32, no. 1, p. 30-38

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Consortium of Swiss Academic Libraries

Weakening and strain localization produced by syn-deformational reaction of plagioclase

Stünitz, Holger ; Tullis, Jan

In: International Journal of Earth Sciences, 2001, vol. 90, no. 1, p. 136-148

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Consortium of Swiss Academic Libraries

Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates

Leinenbach, C. ; Valenza, F. ; Giuranno, D. ; Elsener, H. ; Jin, S. ; Novakovic, R.

In: Journal of Electronic Materials, 2011, vol. 40, no. 7, p. 1533-1541

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Consortium of Swiss Academic Libraries

A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Sivasubramaniam, V. ; Galli, M. ; Cugnoni, J. ; Janczak-Rusch, J. ; Botsis, J.

In: Journal of Electronic Materials, 2009, vol. 38, no. 10, p. 2122-2131

24 Ergebnisse 1 2 3