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Postprint
Consortium of Swiss Academic Libraries

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

Maleki, Milad ; Cugnoni, Joë ; Botsis, John

In: Journal of Electronic Materials, 2014, vol. 43, no. 4, p. 1026-1042

Postprint
Consortium of Swiss Academic Libraries

On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

Maleki, Milad ; Cugnoni, Joel ; Botsis, John

In: Journal of Electronic Materials, 2011, vol. 40, no. 10, p. 2081-2092

Postprint
Consortium of Swiss Academic Libraries

Influence of the moisture content on the fracture characteristics of welded wood joint. Part 2: Mode II fracture

Rhême, Martin ; Botsis, John ; Cugnoni, Joël ; Navi, Parviz

In: Holzforschung, 2013, vol. 67, no. 7, p. 755-761

Postprint
Consortium of Swiss Academic Libraries

Influence of the moisture content on the fracture characteristics of welded wood joint. Part 1: Mode I fracture

Rhême, Martin ; Botsis, John ; Cugnoni, Joël ; Navi, Parviz

In: Holzforschung, 2013, vol. 67, no. 7, p. 747-754

4 résultats 1