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Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys

Weyrich, Nico ; Jin, Shan ; Duarte, Liliana ; Leinenbach, Christian

In: Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1585-1592

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    Titre
    • Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys
    Auteur
    • Weyrich, Nico. Laboratory for Joining Technologies and Corrosion, Empa - Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    • Jin, Shan. Laboratory for Joining Technologies and Corrosion, Empa - Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    • Duarte, Liliana. Laboratory for Joining Technologies and Corrosion, Empa - Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    • Leinenbach, Christian. Laboratory for Joining Technologies and Corrosion, Empa - Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    Type de document
    • Postprint
    Langue
    • Anglais
    Publié dans
    • Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1585-1592. Springer US; http://www.springer-ny.com
    Autre version électronique
    Identifiant OAI-PMH
    • oai:doc.rero.ch:325919
    Summary
    Au-Ge-based solder alloys are promising alternatives to lead containing solders due to the fact that they offer a combination of interesting properties such as good thermal and electrical conductivity and high corrosion resistance in addition to a relatively low melting temperature (361°C for eutectic Au-28Ge at.%). By adding a third element to the eutectic Au-28Ge alloy not only the Au content could be reduced but also the melting temperatures could be further decreased. In this study, in addition to the eutectic Au-28Ge (at.%) two ternary alloys were chosen from the Au-Ge-Sb and Au-Ge-Sn system, respectively. The soldering behavior of these alloys in combination with the frequently used metals Cu, Ni, and Ti was investigated. The interface reactions and microstructures of the joints were characterized in detail by SEM and EDX analysis. For the determination of the mechanical properties, shear tests were conducted. Mean shear strength values up to 104MPa could be achieved.