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Inverse determination of effective mechanical properties of adhesive bondlines = Inverse Bestimmung von effektiven mechanischen Eigenschaften von Klebfugen

Hass, Philipp ; Wittel, Falk ; Mendoza, Miller ; Herrmann, Hans ; Niemz, Peter

In: European Journal of Wood and Wood Products, 2012, vol. 70, no. 6, p. 785-790

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    Title
    • Inverse determination of effective mechanical properties of adhesive bondlines
    Translated Title ()
    • Inverse Bestimmung von effektiven mechanischen Eigenschaften von Klebfugen
    Author
    • Hass, Philipp. Institute for Building Materials, ETH Zurich, Schafmattstrasse 6, 8093, Zurich, Switzerland
    • Wittel, Falk. Institute for Building Materials, ETH Zurich, Schafmattstrasse 6, 8093, Zurich, Switzerland
    • Mendoza, Miller. Institute for Building Materials, ETH Zurich, Schafmattstrasse 6, 8093, Zurich, Switzerland
    • Herrmann, Hans. Institute for Building Materials, ETH Zurich, Schafmattstrasse 6, 8093, Zurich, Switzerland
    • Niemz, Peter. Institute for Building Materials, ETH Zurich, Schafmattstrasse 6, 8093, Zurich, Switzerland
    Document Type
    • Postprint
    Language
    • English
    Published in
    • European Journal of Wood and Wood Products, 2012, vol. 70, no. 6, p. 785-790. Springer-Verlag
    Other Version
    Classification
    • Engineering
    OAI-PMH Identifier
    • oai:doc.rero.ch:322492
    Summary
    A new approach for determining effective mechanical bondline properties using a combined experimental-numerical modal analysis technique is proposed. After characterizing clear spruce wood boards, an adhesive layer is applied to the boards' surfaces. The shift of the eigenfrequencies resulting from the adhesive layer together with information on the bondline geometry can then be used to inversely determine the mechanical properties of the adhesive layer using finite element models. The calculated values for clear wood as well as for the adhesive layer lie within reasonable ranges, thus demonstrating the method's potential