Fulltext

Designing micro-patterned Ti films that survive up to 10% applied tensile strain

Woo, Noble ; Cherenack, Kunigunde ; Tröster, Gerhard ; Spolenak, Ralph

In: Applied Physics A, 2010, vol. 100, no. 1, p. 281-285

Add to personal list
    Title
    • Designing micro-patterned Ti films that survive up to 10% applied tensile strain
    Author
    • Woo, Noble. Laboratory for Nanometallurgy, Department of Materials, ETH Zürich, Wolfgang-Pauli-Strasse 10, 8093, Zürich, Switzerland
    • Cherenack, Kunigunde. Wearable Computing Lab, Institute for Electronics, ETH Zürich, Gloriastrasse 35, 8092, Zürich, Switzerland
    • Tröster, Gerhard. Wearable Computing Lab, Institute for Electronics, ETH Zürich, Gloriastrasse 35, 8092, Zürich, Switzerland
    • Spolenak, Ralph. Laboratory for Nanometallurgy, Department of Materials, ETH Zürich, Wolfgang-Pauli-Strasse 10, 8093, Zürich, Switzerland
    Document Type
    • Postprint
    Classification
    • Engineering
    OAI-PMH Identifier
    • oai:doc.rero.ch:312155
    Summary
    Reducing the strain in brittle device layers is critical in the fabrication of robust flexible electronic devices. In this study, the cracking behavior of micro-patterned 500-nm-thick Ti films was investigated via uniaxial tensile testing by in situ SEM and 4-point probe measurements. Both visual observations by SEM and 4-pt resistance measurements showed that strategically patterned oval holes, off-set and rotated by 45°, had a significant effect on limiting the extent of cracking, specifically, in preventing cracks from converging. Failure with regard to electrical conduction was delayed from less than 2% to more than 10% strain