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Wetting Behavior of Ternary Au-Ge-X (X=Sb, Sn) Alloys on Cu and Ni

Jin, S. ; Valenza, F. ; Novakovic, R. ; Leinenbach, C.

In: Journal of Electronic Materials, 2013, vol. 42, no. 6, p. 1024-1032

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    Titre
    • Wetting Behavior of Ternary Au-Ge-X (X=Sb, Sn) Alloys on Cu and Ni
    Auteur
    • Jin, S.. Empa - Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Joining Technologies and Corrosion, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    • Valenza, F.. National Research Council (CNR), Institute for Energetics and Interphases (IENI), 16149, Genoa, Italy
    • Novakovic, R.. National Research Council (CNR), Institute for Energetics and Interphases (IENI), 16149, Genoa, Italy
    • Leinenbach, C.. Empa - Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Joining Technologies and Corrosion, Überlandstrasse 129, 8600, Dübendorf, Switzerland
    Type de document
    • Postprint
    Langue
    • Anglais
    Publié dans
    • Journal of Electronic Materials, 2013, vol. 42, no. 6, p. 1024-1032. Springer US; http://www.springer-ny.com
    Autre version électronique
    Identifiant OAI-PMH
    • oai:doc.rero.ch:310362
    Summary
    Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X=Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in contact with Cu and Ni substrates has been investigated. Au-13.7Ge-15.3Sn alloy showed complete wetting on both Cu and Ni substrates. Total spreading of Au-15Ge-17Sb alloy on Cu was also observed, while the final contact angle of this alloy on Ni was about 29°. Pronounced dissolution of Cu substrates into the solder alloys investigated was detected, while the formation of Ni-Ge intermetallic compounds at the interface of both solder/Ni systems suppressed the dissolution of Ni into the solder