Consortium of Swiss Academic Libraries

Joining of Cu, Ni, and Ti Using Au-Ge-Based High-Temperature Solder Alloys

Weyrich, Nico ; Jin, Shan ; Duarte, Liliana ; Leinenbach, Christian

In: Journal of Materials Engineering and Performance, 2014, vol. 23, no. 5, p. 1585-1592

Université de Fribourg

Tunable 2D binary colloidal alloys for soft nanotemplating

Fernández-Rodríguez, Miguel Ángel ; Elnathan, Roey ; Ditcovski, Ran ; Grillo, Fabio ; Conley, Gaurasundar Marc ; Timpu, Flavia ; Rauh, Astrid ; Geisel, Karen ; Ellenbogen, Tal ; Grange, Rachel ; Scheffold, Frank ; Karg, Matthias ; Richtering, Walter ; Voelcker, Nicolas H. ; Isa, Lucio

In: Nanoscale, 2018, vol. 10, no. 47, p. 22189–22195

The realization of non-close-packed nanoscale patterns with multiple feature sizes and length scales via colloidal self-assembly is a highly challenging task. We demonstrate here the creation of a variety of tunable particle arrays by harnessing the sequential self-assembly and deposition of two differently sized microgel particles at the fluid–fluid interface. The two-step process is...

Consortium of Swiss Academic Libraries

Damage assessment in structural metallic materials for advanced nuclear plants

Hoffelner, Wolfgang

In: Journal of Materials Science, 2010, vol. 45, no. 9, p. 2247-2257

Consortium of Swiss Academic Libraries

The implant material, Ti6Al7Nb: surface microstructure, composition and properties

Sittig, C. ; Ha¨hner, G. ; Marti, A. ; Textor, M. ; Spencer, N. ; Hauert, R.

In: Journal of Materials Science: Materials in Medicine, 1999, vol. 10, no. 4, p. 191-198

Consortium of Swiss Academic Libraries

Assessment of the Atomic Mobilities in fcc Cu-Fe and Cu-Ti Alloys

Wang, J. ; Leinenbach, C. ; Liu, L. ; Liu, H. ; Jin, Z.

In: Journal of Phase Equilibria and Diffusion, 2011, vol. 32, no. 1, p. 30-38